The design of Xiaomi Mix Flip has been revealed before the launch. The phone is going to knock in China on July 19. The company has teased the design and color variants. The phone is going to come in three shades which will include black, white and purple. It has a dual camera which is in vertical position. Two holes are visible on the top edge of the phone which can be a microphone and IR blaster. The SIM slot is given on the bottom edge. There is also a USB-C port here and a microphone. Along with these, the speaker has also been given space here. Xiaomi CEO Li Jun shared the poster of the phone on social media. share At the same time, tipster Abhishek Yadav has also shared Xiaomi’s Xiaomi Mix Flip official teaser post from his X handle.
The volume buttons and power buttons of the phone are given on the right side. The company has also confirmed some specifications of Xiaomi Mix Flip. The phone will have Qualcomm’s Snapdragon 8 Gen 3 chipset. It will have LPDDR5x RAM and UFS 4.0 storage. It will be equipped with 3D vapor chamber cooling system. The phone will have a 4,780mAh battery. Along with this, 67W fast charging support can be seen.
Apart from this, the phone will have support for Leica camera. The company can offer Mix Flip in 12 GB RAM and 16 GB RAM variants. While in terms of storage, the phone can come with 1TB space. Android 14 based HyperOS operating system can be seen in it. Now only one day is left in the launch of the phone. Stay connected with Gadgets 360 for the latest updates.
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